I am updating the PCB to a 4layer design (with added combined footprints for films and tants plus the possibiliy to thermally couple the relevant transistors) with hopefully better layout and have a question regarding a possible GND-plane: I plan to have the signal tracks on the bottom layer, the inner layers carrying the signal- and power-GND tracks, and the top layer is almost empty and could be used as a copper shield under the components - if that would be a good idea I don't know since I am a hobby amateur. So I ask for your input on this! Please have a look at attached pictures:
The copper plane on the top layer is only connected to PWR_GND at one point (the one in the middle of the PCB). The PWR_GND tracks from there will be routed seperatedly:
pink = power_GND
yellow = signal_GND
Please let me know if you think using the top copper layer as a shield is a good idea!
The copper plane on the top layer is only connected to PWR_GND at one point (the one in the middle of the PCB). The PWR_GND tracks from there will be routed seperatedly:
pink = power_GND
yellow = signal_GND
Please let me know if you think using the top copper layer as a shield is a good idea!