mega lord
Centre tapped
Hi,
After reading Les W's book of mods i thought i might try using these pads on the inners of my naim electronics. Les suggests that putting a pad on the top inner surface of the cases reduces the ringing and bennefits microphonic components such as semiconductors.
Has anyone tried this approach. There are different sorts of pads available such as self adhesive bitumen and products used in cars such as Brown Bread and Damplifier pro. These car products whilst being expensive and resistant to heat, have a foil layer on them. I am concerned that this metal foil will cause problems - is this so ? The ordinary bitumen pads called dedeshete (wilmslow) look good but as they are stated for use in speakers, will they be resistant to the sort of heat which my nap140, hicaps and cd3.5 kick out ? Obviously i dont want to limit the heat sink capabilities of the case or have black sludge leaking all over the place. If people here tell me its ok, i will go ahead and place it on inner top of cases and maybe cut some small strips to go in unused spaces on nac72 motherboard and speaker xover boards.
Thanks for any advice stu
After reading Les W's book of mods i thought i might try using these pads on the inners of my naim electronics. Les suggests that putting a pad on the top inner surface of the cases reduces the ringing and bennefits microphonic components such as semiconductors.
Has anyone tried this approach. There are different sorts of pads available such as self adhesive bitumen and products used in cars such as Brown Bread and Damplifier pro. These car products whilst being expensive and resistant to heat, have a foil layer on them. I am concerned that this metal foil will cause problems - is this so ? The ordinary bitumen pads called dedeshete (wilmslow) look good but as they are stated for use in speakers, will they be resistant to the sort of heat which my nap140, hicaps and cd3.5 kick out ? Obviously i dont want to limit the heat sink capabilities of the case or have black sludge leaking all over the place. If people here tell me its ok, i will go ahead and place it on inner top of cases and maybe cut some small strips to go in unused spaces on nac72 motherboard and speaker xover boards.
Thanks for any advice stu